DB Assemblies – Hybrid
At Radius CTS, we understand that no two projects are the same and we can offer added flexibility to your network design with hybrid microduct assemblies that combine microducts of various diameters into one bundle to best suit your requirements.
Designed to be buried directly into prepared ground or installed into a duct, assemblies typically comprise of a variety of low friction HDPE microducts surrounded with either a single or double PE sheath, with an optional moisture barrier (water blocking tape or aluminum layer)
Features & Benefits
- Many microduct combinations
- Many configurations available from 1 to 24way
- Direct Bury or Direct Install type
- High-performance Low Friction HDPE microducts
- Moisture barrier optional
- Bespoke solutions are available
The Sky is the Limit
There are many available options for hybrid products.
Please do contact us to discuss your requirements
Options
Microducts:
- Inner Wall: Smooth or Ribbed
- Colour: Solid / Translucent / Stripes
- Numbering
- Customer Specific Print
- UV Stabilisation
- Pre-Cabling
Assembly:
- Tracer Wire
- Ripcord
- Striped Sheath Option
- Moisture barrier aluminium or water blocking tape
- UV Stabilisation
Certification
- Made to ISO 60794-1-21 : 2015 & ISO 60794-5-10 : 2014
- Duct can be manufactured to BS EN 61386-24 : 2010
- Duct can be manufactured to SKZ HR 3.54 : 2019-07
Microducts and outer sheath are available in 12 colours:
Installation:
- Direct Bury (DB)
- Directional Drilling
- Mole Ploughing
- Narrow Trenching
- Underground
Applications:
- Backbone
- Campus
- Drop
- FTTh
- Last Mile